HENGLI firing and drying conveyor belt furnaces are widely used in SMT, solar cell (photovoltaic) manufacturing,semiconductor packaging, circuit board assembly, and advanced materials processing (thick film, thin film, metals, ceramics, and various electronic components), and noble metal annealing.
Hengli’s products are CE marked and fulfill the latest safety requirements. In more than twenty years, Hengli products have reached satisfied customers in the United States, Australia, Hungary, Italy, India, Singapore more than 20+ countries and regions. Customers include well respected corporations like IBM, NASA and The Royal Canadian Mint.
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Hybrids, Thin Film, LC filters, Substrates, MEMS
Standard and Customized solutions for microelectronic modules, packages and substrates for Hybrids, Thin Film, LC Fliters, MEMS, Power packages, Glass/Metal Sealed Packages, Microwave Housing
IConnPSPLUSTM is the new State-of-the-Art in Fully Automatic Wire Bonding. With its upgraded and enhanced subsystems, it is engineered to deliver all the capability you will need -- For Wire Bonding today, PLUS tomorrow.
IConnPLUS is designed to meet all leading edge wire bonding challenges.
Metal packages for microelectronics industry
• Package bodies and lids • Substrate carriers • Microwave circuit supports • Heatsinks • Formed feed-throughs and lead-frames • Device mounts