IConnPSPLUSTM is the new State-of-the-Art in Fully Automatic Wire Bonding. With its upgraded and enhanced subsystems, it is engineered to deliver all the capability you will need -- For Wire Bonding today, PLUS tomorrow.
IConnPLUS is designed to meet all leading edge wire bonding challenges.
Hybrids, Thin Film, LC filters, Substrates, MEMS
Standard and Customized solutions for microelectronic modules, packages and substrates for Hybrids, Thin Film, LC Fliters, MEMS, Power packages, Glass/Metal Sealed Packages, Microwave Housing
The AsterionTM Wedge Bonder is
built on an enhanced architecture that includes an expanded bond area, new
robust pattern recognition capabilities and extremely tight process controls.
Together these deliver heightened productivity, bonding quality, and
reliability. The enlarged bondable area enhances flexibility and reduces line
integration costs. Asterion is driven by a precise new direct-drive motion
system that requires minimum maintenance and delivers high repeatability.
Powerful new software features, like the graphical editor, make programming
complex devices easier, and multi-segmented bonding includes flexible tools to
deliver an optimized bonding process.
Metal packages for microelectronics industry
• Package bodies and lids • Substrate carriers • Microwave circuit supports • Heatsinks • Formed feed-throughs and lead-frames • Device mounts