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IConnPS PLUS

IConnPS PLUSTM
For Bonding Today, PLUS Tomorrow
 
IConnPS PLUSTM is the new State-of-the-Art in Fully Automatic Wire Bonding. With its upgraded and enhanced subsystems, it is engineered to deliver all the capability you will need -- For Wire Bonding today, PLUS tomorrow.

IConn PLUS is designed to meet all leading edge wire bonding challenges.

       
Products
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ADT- Advanced Dicing Technologies

2 and 4 Inch Spindle Dicing System

Kulicke & Soffa

Asterion Enhanced Capability Hybrid Wedge Bonder

Hengli Eletek

Belt Furnaces for Solar, Hybrids and LTCC

Various

Hybrids, Thin Film, LC filters, Substrates, MEMS

Kulicke & Soffa

IConnPS PLUS

Various

Metal packages for microelectronics industry
   
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