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Reflow Soldering System - Batch Oven
Manufacturer SEF
Product Code RP6
Product Name Reflow Soldering System - Batch Oven
Product Description

Max PCB size: 200 x 300 mm

Max reflow temp.: 280 to 300 deg. C

Built in temperature profiler with 3 channels

PCB cooling with 2 x fans

Profile creation by user defined time and temp. data points

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