The TMT-PH300 uses advanced intelligent temperature control technology to control the infrared preheater. Three heating modes allow the unit to handle leaded & lead-free preheating processes and are suitable for use with PCB containing BGA and SMD components.
Microprocessor accurately regulates temperature.
Three heating modes to meet different soldering requirements.
Professional board holder allows three dimensional adjustments.
Large quartz heating element suitable for large sized PCBA.
Thermaltronics DS-KIT-1 desoldering kit for use on the TMT-9000S uses shop air to create a powerful air vacuum to clean through-holes quickly and efficiently. Cleaning and maintenance is quick and easy with the use of replaceable filter wools (DS-FW-1) and chamber liners (DS-CL-1).
Hot Air Tool
The TMT-HA200 hot air tool can be used for surface mount component removal and reflow on components such as SOIC, CHIP, QFP, PLCC and others.
Auto sleep activated when hot air tool is placed in the holder.
Lightweight and compact, takes up minimal table space.
Large selection of high quality nozzles.
Adjustable, easy to use temperature and air control knobs.