The MINIOVEN 05 is a compact and robust table-top device specially designed for re-balling of BGAs and pre-bumping of QFN components. Its highly efficient hybrid heating technology heats-up the electronic components like in a standard reflow oven: Gently and simultaneously from all sides and guarantees repeatable process results with high yield. MINIOVEN 05 is perfect for use in both production and R&D environments.
Low profile bottom heater for pre-warming of PCB
Applications for underheaters range from pre-heating of PCBs for hand soldering tasks over pre-heating for automated machine rework to curing or cracking of underfill.
MARTIN offers a wide choice of underheaters. They can be classified by size of the heater and heater performance. For small boards IR systems are available up to a power rating of 2.000W. For medium sized boards and above Hybrid heaters between 3.000 and 10.000 W are on offer.
Manual rework of BGA, CSP, QFP and sockets
The EXPERT 04.6 equipment family provides optimal support in the manual rework station environment. Designed to provide all the functions required for Rework and ergonomically arranged in a very compact space, the unit incorporates: heating, residual solder removal and dispensing. The heating technology employed guaranties exemplary soldering results
Family of hot gas reflow systems with high degree of automation
CCD-camera supported rework of BGA, CSP, QFN
The Expert 10.6 rework stations facilitates the reliable and precise rework of BGA-, CSP-, and QFN-components, connectors and sockets. Innovative technologies such as “Advanced Vision Placement”, Hybrid Heating Technology and the intuitively operated “Easy Solder” software ensure safe soldering and de-soldering without the intervention of operators in the soldering process.