The EXPERT 04.6 equipment family provides optimal support in the manual rework station environment. Designed to provide all the functions required for Rework and ergonomically arranged in a very compact space, the unit incorporates: heating, residual solder removal and dispensing. The heating technology employed guaranties exemplary soldering results
Compact Reflow-MINIOVEN for a desktop
The MINIOVEN 05 is a compact and robust table-top device specially designed for re-balling of BGAs and pre-bumping of QFN components. Its highly efficient hybrid heating technology heats-up the electronic components like in a standard reflow oven: Gently and simultaneously from all sides and guarantees repeatable process results with high yield. MINIOVEN 05 is perfect for use in both production and R&D environments.
Family of hot gas reflow systems with high degree of automation
CCD-camera supported rework of BGA, CSP, QFN
The Expert 10.6 rework stations facilitates the reliable and precise rework of BGA-, CSP-, and QFN-components, connectors and sockets. Innovative technologies such as “Advanced Vision Placement”, Hybrid Heating Technology and the intuitively operated “Easy Solder” software ensure safe soldering and de-soldering without the intervention of operators in the soldering process.
Low profile bottom heater for pre-warming of PCB
Applications for underheaters range from pre-heating of PCBs for hand soldering tasks over pre-heating for automated machine rework to curing or cracking of underfill.
MARTIN offers a wide choice of underheaters. They can be classified by size of the heater and heater performance. For small boards IR systems are available up to a power rating of 2.000W. For medium sized boards and above Hybrid heaters between 3.000 and 10.000 W are on offer.