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REFLOW OVENS

How do I choose a reflow oven?

Reflow ovens are sized primarily based on the required throughput.
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Typical solder reflow Profile Targets:

  1. Peak temperature = 240+/-5°C.
  2. TAL/Time above liquidus (221) = 30 to 60 seconds.
  3. Soak (activation) = 150 to 200°C for 0-60 seconds.
  4. Ramps = 2.5°C/second max for heating, -1.5°C/second for cooling.

How hot is a reflow oven?

Reflow - this is the area where the temperature is elevated to between 230 and 250°C. A critical measure is the time above reflow, which typically lasts between 45 and 90 seconds

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