JU-110-3 ensures excellent shape retention, enabling continual application of tall print deposits. Therefore, contact with surface-mounted components of any shape is achieved, improving reliability of the wave soldering process.
JU-90LT-3 cures at low temperatures around 90-100?, reducing
the level of oxidation for the components and substrate. It enables improvement in the overall product quality and first time product quality.
Using a conventional adhesive with solder paste can result in the
lifting of components during reflow because the adhesive cures
before the solder paste melts. JU-R4S maintains its fluidity while
the solder is molten and facilitates setting of the components.