+27 (0)11 609 1244 | ZETECH@ZETECH.CO.ZA

SMT Adhesives

REACH compliant SMT adhesive for dispensing

JU-110-3 ensures excellent shape retention, enabling continual application of tall print deposits. Therefore, contact with surface-mounted components of any shape is achieved, improving reliability of the wave soldering process.

Read More

Contact Zetech

Printing adhesive

JU-50P achieves a consistent stencil release property regardless of the pattern size and shape. It also secures stable print shape during continuous use.

Read More

Contact Zetech

Low Curing Temperature Heat Curable SMT Adhesive

JU-90LT-3 cures at low temperatures around 90-100?, reducing
the level of oxidation for the components and substrate. It enables improvement in the overall product quality and first time product quality.

Read More

Contact Zetech

Heat Curable SMT Adhesive for Dispensing

Using a conventional adhesive with solder paste can result in the
lifting of components during reflow because the adhesive cures
before the solder paste melts. JU-R4S maintains its fluidity while
the solder is molten and facilitates setting of the components.

Read More

Contact Zetech<

+27 (0)11 609 1244 | ZETECH@ZETECH.CO.ZA