JU-110-3 ensures excellent shape retention, enabling continual application of tall print deposits. Therefore, contact with surface-mounted components of any shape is achieved, improving reliability of the wave soldering process.
JU-110-3 ensures excellent shape retention, enabling continual application of tall print deposits. Therefore, contact with surface-mounted components of any shape is achieved, improving reliability of the wave soldering process.
JU-110-3 ensures excellent shape retention, enabling continual application of tall print deposits. Therefore, contact with surface-mounted components of any shape is achieved, improving reliability of the wave soldering process.
JU-50P achieves a consistent stencil release property regardless of the pattern size and shape. It also secures stable print shape during continuous use.
JU-50P achieves a consistent stencil release property regardless of the pattern size and shape. It also secures stable print shape during continuous use.
JU-50P achieves a consistent stencil release property regardless of the pattern size and shape. It also secures stable print shape during continuous use.
JU-90LT-3 cures at low temperatures around 90-100?, reducing
the level of oxidation for the components and substrate. It enables improvement in the overall product quality and first time product quality.
JU-90LT-3 cures at low temperatures around 90-100?, reducing
the level of oxidation for the components and substrate. It enables improvement in the overall product quality and first time product quality.
JU-90LT-3 cures at low temperatures around 90-100?, reducing
the level of oxidation for the components and substrate. It enables improvement in the overall product quality and first time product quality.
Using a conventional adhesive with solder paste can result in the
lifting of components during reflow because the adhesive cures
before the solder paste melts. JU-R4S maintains its fluidity while
the solder is molten and facilitates setting of the components.
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Using a conventional adhesive with solder paste can result in the
lifting of components during reflow because the adhesive cures
before the solder paste melts. JU-R4S maintains its fluidity while
the solder is molten and facilitates setting of the components.
Using a conventional adhesive with solder paste can result in the
lifting of components during reflow because the adhesive cures
before the solder paste melts. JU-R4S maintains its fluidity while
the solder is molten and facilitates setting of the components.