S3X58-HF1100 has applied a newly engineered flux technology in which solder particles are protected from being oxidized by an easy-to-remove protective layer and the antioxidant in the flux suppresses continued oxidation over time.
...S3X58-HF1100 has applied a newly engineered flux technology in which solder particles are protected from being oxidized by an easy-to-remove protective layer and the antioxidant in the flux suppresses continued oxidation over time.
S3X58-HF1100 has applied a newly engineered flux technology in which solder particles are protected from being oxidized by an easy-to-remove protective layer and the antioxidant in the flux suppresses continued oxidation over time.
Mycronic, a Swedish industrial machine manufacturer, has approved the use of S3X70-E160DN with their jetting machies MY600 and MY700.
Mycronic, a Swedish industrial machine manufacturer, has approved the use of S3X70-E160DN with their jetting machies MY600 and MY700.
Mycronic, a Swedish industrial machine manufacturer, has approved the use of S3X70-E160DN with their jetting machies MY600 and MY700.
Mycronic, a Swedish industrial machine manufacturer, has
approved the use of SS70-E160DN with their jetting machines
MY600 and MY700.
Mycronic, a Swedish industrial machine manufacturer, has
approved the use of SS70-E160DN with their jetting machines
MY600 and MY700.
Mycronic, a Swedish industrial machine manufacturer, has
approved the use of SS70-E160DN with their jetting machines
MY600 and MY700.
Voids remained inside the solder joint affect the joint quality in various aspects.
Voids remained inside the solder joint affect the joint quality in various aspects.
Voids remained inside the solder joint affect the joint quality in various aspects.
After removal of oxide film at pre-heating stage, a new protective film formed on the surface of solder particles to effectively prevent re-oxidation during the remaining heating process thereby results in powerful wetting/melting.
After removal of oxide film at pre-heating stage, a new protective film formed on the surface of solder particles to effectively prevent re-oxidation during the remaining heating process thereby results in powerful wetting/melting.
After removal of oxide film at pre-heating stage, a new protective film formed on the surface of solder particles to effectively prevent re-oxidation during the remaining heating process thereby results in powerful wetting/melting.
In the conventional solder paste, flux gas gets generated once the solder starts melting, and the flux entrapped in solder
gets discharged by increased inner pressure of molten solder, splattering flux or flux with solder around.
In the conventional solder paste, flux gas gets generated once the solder starts melting, and the flux entrapped in solder
gets discharged by increased inner pressure of molten solder, splattering flux or flux with solder around.
In the conventional solder paste, flux gas gets generated once the solder starts melting, and the flux entrapped in solder
gets discharged by increased inner pressure of molten solder, splattering flux or flux with solder around.
Currently, application of 0201/03015 size components is limited to mobile devices such as a blue tooth or GPS module.
In the future, miniaturization of electric device is expected to accelerate and the demand for micro size components can be increased.
Currently, application of 0201/03015 size components is limited to mobile devices such as a blue tooth or GPS module.
In the future, miniaturization of electric device is expected to accelerate and the demand for micro size components can be increased.
Currently, application of 0201/03015 size components is limited to mobile devices such as a blue tooth or GPS module.
In the future, miniaturization of electric device is expected to accelerate and the demand for micro size components can be increased.
Demand for laser soldering is increasing especially for consumer product market in camera modules and connector pins. Since the laser soldering can be completed without the laser actually touching component, it can not only avoid heavy thermal stresses but also the temperature variance
...Demand for laser soldering is increasing especially for consumer product market in camera modules and connector pins. Since the laser soldering can be completed without the laser actually touching component, it can not only avoid heavy thermal stresses but also the temperature variance
Demand for laser soldering is increasing especially for consumer product market in camera modules and connector pins. Since the laser soldering can be completed without the laser actually touching component, it can not only avoid heavy thermal stresses but also the temperature variance
S3X58-M650-7 prevents the buildup of thick and sticky flux residue over the solder joint, which helps the testing probe to get the accurate readings to improve the first pass rate.
S3X58-M650-7 prevents the buildup of thick and sticky flux residue over the solder joint, which helps the testing probe to get the accurate readings to improve the first pass rate.
S3X58-M650-7 prevents the buildup of thick and sticky flux residue over the solder joint, which helps the testing probe to get the accurate readings to improve the first pass rate.
The melting temperature of T4AB58-HF360 is 138-140ºC, lower than SAC305 making it ideal for soldering heat-sensitive components and PCBs. As the reflow profile can be set lower, the energy consumption can be reduced by approx. 40%.
...The melting temperature of T4AB58-HF360 is 138-140ºC, lower than SAC305 making it ideal for soldering heat-sensitive components and PCBs. As the reflow profile can be set lower, the energy consumption can be reduced by approx. 40%.
The melting temperature of T4AB58-HF360 is 138-140ºC, lower than SAC305 making it ideal for soldering heat-sensitive components and PCBs. As the reflow profile can be set lower, the energy consumption can be reduced by approx. 40%.
Chemical reactions between solder powders and flux occurring in solder paste at room temperature are minimized, which effectively eliminates issues such as thickening and enables long-term storage at room temperature.
Chemical reactions between solder powders and flux occurring in solder paste at room temperature are minimized, which effectively eliminates issues such as thickening and enables long-term storage at room temperature.
Chemical reactions between solder powders and flux occurring in solder paste at room temperature are minimized, which effectively eliminates issues such as thickening and enables long-term storage at room temperature.
When testing insulation reliability and flux residues, a 0.317mm gap comb coupon is normally used for both JIS and IPC standards. However, more and more customers are recently requesting a narrower gap test coupon.
When testing insulation reliability and flux residues, a 0.317mm gap comb coupon is normally used for both JIS and IPC standards. However, more and more customers are recently requesting a narrower gap test coupon.
When testing insulation reliability and flux residues, a 0.317mm gap comb coupon is normally used for both JIS and IPC standards. However, more and more customers are recently requesting a narrower gap test coupon.
A very small amount of two modifying elements Bi and Ni are added. Different effects from these elements achieved strong and easy-to-use low Ag solder that is equivalent to or superior to SAC305, such as the melting point, thermal resistance, and time-dependent change in crystal structures.Click here for the mechanism of hybrid reinforcement.
...A very small amount of two modifying elements Bi and Ni are added. Different effects from these elements achieved strong and easy-to-use low Ag solder that is equivalent to or superior to SAC305, such as the melting point, thermal resistance, and time-dependent change in crystal structures.Click here for the mechanism of hybrid reinforcement.
A very small amount of two modifying elements Bi and Ni are added. Different effects from these elements achieved strong and easy-to-use low Ag solder that is equivalent to or superior to SAC305, such as the melting point, thermal resistance, and time-dependent change in crystal structures.Click here for the mechanism of hybrid reinforcement.
A very small amount of two modifying elements Bi and Ni are added. Different effects from these elements achieved strong and easy-to-use low Ag solder that is equivalent to or superior to SAC305, such as the melting point, thermal resistance, and time-dependent change in crystal structures.Click here for the mechanism of hybrid reinforcement.
...A very small amount of two modifying elements Bi and Ni are added. Different effects from these elements achieved strong and easy-to-use low Ag solder that is equivalent to or superior to SAC305, such as the melting point, thermal resistance, and time-dependent change in crystal structures.Click here for the mechanism of hybrid reinforcement.
A very small amount of two modifying elements Bi and Ni are added. Different effects from these elements achieved strong and easy-to-use low Ag solder that is equivalent to or superior to SAC305, such as the melting point, thermal resistance, and time-dependent change in crystal structures.Click here for the mechanism of hybrid reinforcement.
S1XBIG58-M650-7 prevents the buildup of thick and sticky flux residue over the solder joint, which helps the testing probe to get the accurate readings to improve the first pass rate.
S1XBIG58-M650-7 prevents the buildup of thick and sticky flux residue over the solder joint, which helps the testing probe to get the accurate readings to improve the first pass rate.
S1XBIG58-M650-7 prevents the buildup of thick and sticky flux residue over the solder joint, which helps the testing probe to get the accurate readings to improve the first pass rate.
For PCBs exposed to severe temperature fluctuation,
long term durable alloys are required to counter thermal cycling induced stress.
For PCBs exposed to severe temperature fluctuation,
long term durable alloys are required to counter thermal cycling induced stress.
For PCBs exposed to severe temperature fluctuation,
long term durable alloys are required to counter thermal cycling induced stress.
SAC type solder joint cannot comply with longer product life requirement for such application that are exposed to significant higher temperatures. To make a much stronger, fatigue resistant joint possible, solid solution strengthening of Sn crystal lattice is facilitated by addition of In and Bi.
SAC type solder joint cannot comply with longer product life requirement for such application that are exposed to significant higher temperatures. To make a much stronger, fatigue resistant joint possible, solid solution strengthening of Sn crystal lattice is facilitated by addition of In and Bi. For PCBs exposed to severe temperature fluctuation, long term durable alloys are required to counter thermal cycling induced stress. â– Mechanism of crack occurrence by thermal cycling stress For PCBs exposed to severe temperature fluctuation, long term durable alloys are required to counter thermal cycling induced stress. â– Mechanism of crack occurrence by thermal cycling stress For PCBs exposed to severe temperature fluctuation, long term durable alloys are required to counter thermal cycling induced stress. â– Mechanism of crack occurrence by thermal cycling stress SAC type solder joint cannot comply with longer product life requirement for such application that are exposed to significant higher temperatures. To make a much stronger, fatigue resistant joint possible, solid solution strengthening of Sn crystal lattice is facilitated by addition of In and Bi.
SAC type solder joint cannot comply with longer product life requirement for such application that are exposed to significant higher temperatures. To make a much stronger, fatigue resistant joint possible, solid solution strengthening of Sn crystal lattice is facilitated by addition of In and Bi. By adopting special resin into the flux, the residue remains flexible at a wider temperature range. Cracking during thermal cycling is suppressed, and ion migration due to condensation is significantly reduced. By adopting special resin into the flux, the residue remains flexible at a wider temperature range. Cracking during thermal cycling is suppressed, and ion migration due to condensation is significantly reduced. By adopting special resin into the flux, the residue remains flexible at a wider temperature range. Cracking during thermal cycling is suppressed, and ion migration due to condensation is significantly reduced. Non-contact application of solder paste allows repeated deposition to one specific spot. Amount of solder paste is adjustable according to the size of components, thus securing high reliability at the solder joint. Non-contact application of solder paste allows repeated deposition to one specific spot. Amount of solder paste is adjustable according to the size of components, thus securing high reliability at the solder joint. Non-contact application of solder paste allows repeated deposition to one specific spot. Amount of solder paste is adjustable according to the size of components, thus securing high reliability at the solder joint. The reason why graping often occurs while using fine particle solder paste is an increase in the amount of oxide layers due to a larger amount of fine particles printed. The reason why graping often occurs while using fine particle solder paste is an increase in the amount of oxide layers due to a larger amount of fine particles printed. The reason why graping often occurs while using fine particle solder paste is an increase in the amount of oxide layers due to a larger amount of fine particles printed. S3X70-G835 adopts a type of non-volatile solvent as its primary constituent, and can keep itself from drying when the paste is left idle. S3X70-G835 adopts a type of non-volatile solvent as its primary constituent, and can keep itself from drying when the paste is left idle. S3X70-G835 adopts a type of non-volatile solvent as its primary constituent, and can keep itself from drying when the paste is left idle. GSP's crack-free flux residue acts as a coating and prevents condensation and contamination at joints. Therefore, residue washing or coating is not needed. The number of processes will be reduced, and significant cost benefit can be anticipated.Ideal for extreme environments
High durability alloy solder paste
ncreasing demand for high thermal stress durability
ncreasing demand for high thermal stress durability
ncreasing demand for high thermal stress durability
In-containing high reliability alloy solder paste
Ideal for extreme environments
Ideal for extreme environments
Applicable for air reflow crack free flux residue
Suppresses ion migration
Suppresses ion migration
Suppresses ion migration
Non-contact jet dispensing applicable solder paste
Consistently Deposited Solder
Consistently Deposited Solder
Consistently Deposited Solder
Dispensing solder paste for super find pitch
Uniformly spherical solder powder
Uniformly spherical solder powder
Uniformly spherical solder powder
Micro-pattern Application Halogen Free Solder Past
Reduces defects during stencil printing
with a newly developed lubrication techniqueReduces defects during stencil printing
with a newly developed lubrication technique
Reduces defects during stencil printing
with a newly developed lubrication technique
Solder paste develop in collaboration with TOYOTA
No residue washing or coating required