+27 (0)11 609 1244 | ZETECH@ZETECH.CO.ZA

Soldering Paste

Multi-feature Halogen-free LF Solder Paste

Powerful Wetting Technique Advances Solder Joint Reliability

S3X58-HF1100 has applied a newly engineered flux technology in which solder particles are protected from being oxidized by an easy-to-remove protective layer and the antioxidant in the flux suppresses continued oxidation over time.

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Mycronic-approved Solder Paste for Jet Dispensing

Solder paste approved by Mycronic

Mycronic, a Swedish industrial machine manufacturer, has approved the use of S3X70-E160DN with their jetting machies MY600 and MY700.

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Mycronic-approved Leaded Solder Paste for Jet Disp

Solder paste approved by Mycronic

Mycronic, a Swedish industrial machine manufacturer, has
approved the use of SS70-E160DN with their jetting machines
MY600 and MY700.

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Ultra Low Void Lead Free Solder Paste

Ensures stable and ultra low voiding regardless of component type and reflow profiles

Concerns with Voiding

Voids remained inside the solder joint affect the joint quality in various aspects.

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Upgraded Powerful Wetting General Purpose Solder P

Activator Technique

After removal of oxide film at pre-heating stage, a new protective film formed on the surface of solder particles to effectively prevent re-oxidation during the remaining heating process thereby results in powerful wetting/melting.

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Low Flux Splattering Halogen Free Solder Paste

Mechanism of Flux Splattering & Anti-Splattering Technique

In the conventional solder paste, flux gas gets generated once the solder starts melting, and the flux entrapped in solder
gets discharged by increased inner pressure of molten solder, splattering flux or flux with solder around.

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Lead Free Solder Paste for Micro-pattern App

Application of 0201/03015 Components and Future Projection

Currently, application of 0201/03015 size components is limited to mobile devices such as a blue tooth or GPS module.
In the future, miniaturization of electric device is expected to accelerate and the demand for micro size components can be increased.

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Halogen-free Solder Paste for Laser Soldering

Increasing Demand for Laser Soldering

Demand for laser soldering is increasing especially for consumer product market in camera modules and connector pins. Since the laser soldering can be completed without the laser actually touching component, it can not only avoid heavy thermal stresses but also the temperature variance

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Halogen Free Pin Testable Solder Paste

Good inspection properties

S3X58-M650-7 prevents the buildup of thick and sticky flux residue over the solder joint, which helps the testing probe to get the accurate readings to improve the first pass rate.

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Low melting point solder paste

Energy-saving whilst reducing thermal damage to components and board

The melting temperature of T4AB58-HF360 is 138-140ºC, lower than SAC305 making it ideal for soldering heat-sensitive components and PCBs. As the reflow profile can be set lower, the energy consumption can be reduced by approx. 40%.

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Solder paste for storage at room temperature

New technology for room temperature storage

Chemical reactions between solder powders and flux occurring in solder paste at room temperature are minimized, which effectively eliminates issues such as thickening and enables long-term storage at room temperature.

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Super High Reliability Halogen Free

Reliability Challenges in Narrow Gap Patterns

When testing insulation reliability and flux residues, a 0.317mm gap comb coupon is normally used for both JIS and IPC standards. However, more and more customers are recently requesting a narrower gap test coupon.

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SAC305 reflow profile applicable halogen free

The only difference from SAC305 is "low cost"

A very small amount of two modifying elements Bi and Ni are added. Different effects from these elements achieved strong and easy-to-use low Ag solder that is equivalent to or superior to SAC305, such as the melting point, thermal resistance, and time-dependent change in crystal structures.Click here for the mechanism of hybrid reinforcement.

Hybrid high reliability halogen free

The only difference from SAC305 is "low cost"

A very small amount of two modifying elements Bi and Ni are added. Different effects from these elements achieved strong and easy-to-use low Ag solder that is equivalent to or superior to SAC305, such as the melting point, thermal resistance, and time-dependent change in crystal structures.Click here for the mechanism of hybrid reinforcement.

Low Ag containing, SAC305 profile applicable

High ICT first pass yield

S1XBIG58-M650-7 prevents the buildup of thick and sticky flux residue over the solder joint, which helps the testing probe to get the accurate readings to improve the first pass rate.

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True Halogen Free High Reliability Alloy

Increasing demand for high thermal stress

For PCBs exposed to severe temperature fluctuation,
long term durable alloys are required to counter thermal cycling induced stress.

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In-containing high reliability alloy halogen-free

Ideal for extreme environments

SAC type solder joint cannot comply with longer product life requirement for such application that are exposed to significant higher temperatures. To make a much stronger, fatigue resistant joint possible, solid solution strengthening of Sn crystal lattice is facilitated by addition of In and Bi.

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In-containing high reliability alloy solder paste

Ideal for extreme environments

SAC type solder joint cannot comply with longer product life requirement for such application that are exposed to significant higher temperatures. To make a much stronger, fatigue resistant joint possible, solid solution strengthening of Sn crystal lattice is facilitated by addition of In and Bi.

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Non-contact jet dispensing applicable solder paste

Consistently Deposited Solder

Non-contact application of solder paste allows repeated deposition to one specific spot. Amount of solder paste is adjustable according to the size of components, thus securing high reliability at the solder joint.

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Dispensing solder paste for super find pitch

Uniformly spherical solder powder

The reason why graping often occurs while using fine particle solder paste is an increase in the amount of oxide layers due to a larger amount of fine particles printed.

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Micro-pattern Application Halogen Free Solder Past

Reduces defects during stencil printing
with a newly developed lubrication technique

S3X70-G835 adopts a type of non-volatile solvent as its primary constituent, and can keep itself from drying when the paste is left idle.

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Solder paste develop in collaboration with TOYOTA

No residue washing or coating required

GSP's crack-free flux residue acts as a coating and prevents condensation and contamination at joints. Therefore, residue washing or coating is not needed. The number of processes will be reduced, and significant cost benefit can be anticipated.

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No Clean Leaded Solder Paste
+27 (0)11 609 1244 | ZETECH@ZETECH.CO.ZA